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News Center 2024.11.27

Congratulations! Hero Intelligent Semiconductor High-end Solidifying Machine R&D Group won the Second Prize in the Team Category of the Industry Final of the 11th Baochuang Competition!


In the afternoon of November 22, the 16th China Shenzhen Innovation and Entrepreneurship Competition Bao'an Qualifier and the 11th Shenzhen Bao'an Innovation and Entrepreneurship Competition (hereinafter referred to as “Baochuang Competition”) Award Ceremony was held in the Bay Area New Technology and New Products Exhibition Center, which was guided by Shenzhen Bureau of Science and Technology and Innovation, hosted by the People's Government of Bao'an District, and organized by the Bureau of Science and Technology and Innovation of Bao'an District, Shenzhen. The award ceremony was held in the Bay Area New Technology and New Products Exhibition Center.



Since its launch in June this year, Baochuang Competition has attracted the active participation of many innovative projects, with a total of 605 projects applying for participation. After the fierce competition in the preliminary rounds, the rematch and the industry finals, Hero Intelligent Semiconductor High-end Crystallizer R & D Group stood out by virtue of the project of “Multi-functional, High-precision High-end Chip Crystallizers”, and won the second prize of the team group in the industry finals.



(△Hero Intelligence won the second prize of the team group in the industry final of Baochuang Competition certificate & trophy)


Through technological innovation and breakthroughs, the multifunctional, high-precision high-end chip solidifying machine developed by the R&D team of Hero Intelligence semiconductor high-end solidifying machine has filled the gaps in the domestic market, realizing the domestic substitution of high-end chip encapsulation equipment. The equipment adopts the integrated design of multi-functional module, with high-precision binding capability (accuracy range of up to 7um to 3.5um), which is widely used in optical module communication, GPU, CPU, MCU, MEMS, MEMORY, and image FC module and many other fields, and has become the preferred choice for large-scale integrated circuit packaging.




This award is a recognition of the R&D strength of the semiconductor R&D group of Hero Intelligence, but also a recognition of the company's spirit of continuous innovation. Looking to the future, Hero Intelligence will continue to uphold the spirit of innovation, increase R & D investment, and continue to break through technical bottlenecks, contributing more wisdom and strength to the development of the semiconductor industry.

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